Dublin mobile multimedia processor company Movidius has signed a major deal with Japanese consumer electronics giant Toshiba to develop a high-resolution 3D system for high-end smartphones.
Movidius’ MA1178 has been combined with Toshiba’s 8 Megapixel EDOF (extended depth of field) cameras to enable 3D camera module manufacturers to deliver a compelling 3D imaging solution, ideally suited to top of the range smartphones. EDOF cameras offer distinct advantages over traditional autofocus in terms of 3D synchronisation.
“Movidius’ Myriad 3D solution delivers multimedia features beyond what is offered by any other player in the mobile 3D market,” commented Shiro Ando, vice-president, Toshiba Electronics Europe.
The Movidius MA1178 Dual ISP and video processor chip seamlessly integrates into the handset’s existing platforms with auto-calibration and configuration functionality to simplify the design process and reduce the cost of manufacture.
The Toshiba 8 Megapixel EDOF cameras and the Movidius MA1178 allow a perfect focus matching of stereoscopic images, which leads to superior 3D picture quality.
“Movidius’ leading 3D imaging capabilities complement the high functionality of Toshiba’s EDOF cameras, enabling mobile handset makers to meet consumer demand for a superior 3D mobile experience,” Ando said.
“Simultaneously, they simplify the manufacturing process by rectifying distortion via software rather than requiring laser trimming during production.”
The system solution offers flexibility for customers to implement a symmetric or asymmetric set up of either two 8-megapixel EDOF cameras or a combination of 8 and 3-megapixel EDOF cameras.
“The team at Movidius is very excited to be partnering with Toshiba to develop this leading 3D solution,” said Sean Mitchell, CEO of Movidius.
“Customers seeking to differentiate their product in the highly competitive handset market will benefit from Movidius’ innovative and best quality 3D imaging solution, as well as Toshiba’s worldwide leading position as EDOF camera supplier to the mobile phone market.”
Movidius will demonstrate its MA1178 product together with the 3D system solution at the Mobile World Congress 2012 in Barcelona later this month.
